Packaging, heat dissipation requirements… all kinds of ways to skin the heatsink cat, and a lot of them don’t work well for what they want..
UniverseCameFrmSmthn
Probably have to in order to keep costs down. Heatpipes as I understand are cheaper to mass produce.
Also, innovation isn’t rewarded very well sometimes. As soon as someone develops a winning vapor chamber design, everyone will just copy it and underbid the original designer.
WworthingtonIII
more surface area
TurdFerguson614
You can’t really integrate that dispersed between fins for airflow. There’s a small window between VRM coolers, ram, GPU ect and air has to move through there as well.
StevoMcVevo
Because surface area matter when it comes to dispersing heat.
9 Comments
Packaging, heat dissipation requirements… all kinds of ways to skin the heatsink cat, and a lot of them don’t work well for what they want..
Probably have to in order to keep costs down. Heatpipes as I understand are cheaper to mass produce.
Also, innovation isn’t rewarded very well sometimes. As soon as someone develops a winning vapor chamber design, everyone will just copy it and underbid the original designer.
more surface area
You can’t really integrate that dispersed between fins for airflow. There’s a small window between VRM coolers, ram, GPU ect and air has to move through there as well.
Because surface area matter when it comes to dispersing heat.
Because it’s less efficient /thread
Surface area
More surface area is better.
Some do. Laptops, for example.