I used thermal paste on the chipset die and not a thermal pad. The die wasn’t making good contact with the heatsink in the first and it seems like there was thermal runaway that cracked the die in the middle. First pic is of the parts for the new build the other pics are of the dead motherboard.
It still turns on but there’s not readout on the post LEDs which is a first in the 8 years I’ve had this system. Also I’m not in the US but where can i post to sell my old gear. They’re are in fairly in good condition.
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Yeah components with direct die contact need very precisely mounted coolers. A pad also serves as a mechanical interface but paste isn’t as rigid.
Don’t get that ram, 36-36-36 = Samsung memory= garbage on DDR5, geta a kit of flares or Trident Z with timings 30-38-38 or 32-38-38 those kits are Hynix which is the best DDR5 memory currently available.
If you’re going to air cool, I would recommend the non-X variant. CPU as that one is known for running extremely hot even with 360 AIO also I don’t recommend B series mobo because of the lack of PCIE lanes limiting the amount of future storage upgrades.