Deliding gives one lower thermal resistance to the heatsink and significantly lower temmperatures.
But there is other side of the equation – electric resistance of the power loop.
Where the socket plays significant role – it introduces additional both pin and contact resistance and inductance.
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Has anyone tried de-socketing AM5 MoBo, reballing the chip and soldering it in ? I'd imagine one would have to apply soldermask with round pad holes to both chip and MoBo for this, but this at least seems very doable.
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replacing the low-voltage caps on CPU's side of VRM, each with a battery of MLCCs (say few tens of 10uF/25+V MLCCs)? This should significantly lower their impedance, especially at high frequencies and give them indefinite lifespan.
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adding a couple more power layers through extra copper foils on top of the PCB to lower power inductance/resistance ?
EDIT: Well, this is insane.
Looks like I was clairvoyuant:
* AOOSTAR Launches World’s First AMD Ryzen 9 9955HX3D MoTD Motherboard: 16 “Zen 5” CPU Cores With 3D V-Cache For $650 US, 9955HX For $500