I ordered a set of 1mm thick diamond copper heat sinks, which are used to be sandwiched between water cooling and die as heat diffusion.
cpu=4585px delid(=9950x3d)
aio=liqmaxflo 420
bios=2402
fpu=300w/241a
tim=liquid metal
40%diamond cu pad=40*40*1mm (11.1g with 2.3g diamond)
normal cu pad=14.2g (only to calculate dia%)
The manufacturer claims 60%, but the actual calculation is only 40% dia.
temp1=82.5c(delid) (die-tim-aio)
temp2=78.0c(add 1mm diamond copper)(die-tim-DiaCu-tim-aio)
300W difference is 4.5 degrees!
idle diffence is 0.5 degrees
The actual measurement data is close to the simulation analysis. Next, I will order the best thickness of 3mm and test it again, hoping that the temperature will change lower.